Reworking
PCB Assembly Repair and Rework Service
Printed Circuit Boards are becoming more advanced and complex as technology advances. This means that during assembly process faults can occur or engineering changes need to be implemented. It’s more cost-effective to modify/rework/repair existing electronic assemblies rather than going through a re-make of product, but this has cost and time implications which can be critical at the NPI/launch stage of designs.
Traction Solutions can offer an economical solution for both small to medium quantity production and rework, not just on BGA devices but any fine-pitch components. We can also offer PCB repair and prototype build or modification for times when a rapid service can save both development budget and reputation with your customer.
The ability to modify electronic assemblies is becoming a more specialised skill as components become smaller and PCB’s more densely populated. Our specialist equipment has high levels of placement precision and repeatability and our visual inspection equipment provides high levels of confidence without the cost of x-ray.
In addition to BGA rework we are able to offer replacement or removal of almost any form of component including through-hole multipole connectors for both ROHS and non-ROHS assemblies. Our IPC7711/7721 trained technicians carry out all our repair and rework processes and we are also able to offer a premium rapid turnaround service.
Our Services
Our rework capabilities include:
BGA fitting and replacement using PDR IR rework station
Rework/ Replacement of all surface mount components including but not limited to DFN’s (Dual Flat No Lead), QFN’s (Quad Flat No Lead) components, centre-ground plane components, chip components
Rework/ Replacement of Through Hole Components using Mini-Wave Technologies to minimise damage to PCB barrels
PCB Pad & Track Repairs, PCB laminate repairs and gold plating
Assurances & Training
All work is carried out in line with:
IPC-7711/21D Rework, Modification and Repair of Electronic Assemblies
J-STD-001J Requirements for Soldered Electrical and Electronic Assemblies
IPC-A-610J Acceptability of Electronic Assemblies
IPC/WHMA-A-620E Acceptability of Electronic Wire Harnesses and Cables
BGAs
There is no doubting the benefit that BGA devices have had in the PCBA industry with regard to circuit and PCB design opportunities, but by contrast they have traditionally been a real headache for the manufacturing industry. Putting to one side the difficulties of placement and inspection, the capital required to purchase suitable equipment has often deterred designers from incorporating them into their designs.
Reworking a ball grid array (BGA) can be quite challenging. BGAs are designed to permanently mate the PCB and integrate the circuit, making it difficult to access the connecting pins without potentially damaging the component.
Essential steps for BGA repair:
Component Removal: First, remove the BGA by preheating it until the solder becomes molten, then use a vacuum to remove the BGA. cautious not to damage the PCB pads during this step
Residual Solder Removal: After removing the excess solder, reheat the site with a vacuum to eliminate old and excess solder
Re-ball BGA: Re-balling involves using a stencil to set new solder spheres into the BGA
Re-solder and Reattach Components: Finally, re-solder and reattach the components and PCB
Common mistakes during BGA rework include inadequate operator training
Rework Process
The BGA rework process includes:
localised Infra-Red heating of component,
camera alignment of BGA to PCB,
bespoke profiles for each replacement part to ensure safe removal and no thermal stress of the assembly
Working on components down to 0.3’ pitch and 50mm body size
We can also do PCB Pad & Track Repairs, PCB laminate repairs and gold plating
Terminology
DFN - Dual Flat No lead, which are leadless dual packages with bottom terminal pads and possible edge castellations. The family has both square and rectangular configurations. DFNs are intended to be soldered directly onto circuit boards.
QFN - Quad Flat No lead which are peripheral single row leadless quad packages with bottom terminal pads and possible edge castellations. QFNs are intended to be soldered directly on to circuit boards. Some QFN’s have multiple rows, which are peripheral two or three row leadless quad packages with bottom terminal pads and the outer row having possible edge castellation.
BGA - Ball Grid Array, which is an array family with balls as the bottom terminations. When the BGA has a ceramic substrate, it is called a Ceramic Ball Grid Array (CBGA). When a Ceramic Grid Array has Columns rather than balls, it is called a Ceramic Column Grid Array (CCGA), When a BGA or CGA is sold without balls or columns attached, it is called a Land Grid Array (LGA).
PoP - Package on Package. This packaging concept was developed to provide flexibility to meet the increasing challenges for size and cost reduction while increasing signal processing performance and memory capabilities. The bottom package is a FBGA with FBGA lands on the top side. The top package is a FBGA with balls that are intended to be mounted to the bottom package top side lands.
CSP - Chip Scale Package, which is an array with balls or lands as the bottom terminations. A CSP is intended to be the actual component die size or no more than 1.2 times larger than the component die size.
